Model	Recommended application	Freq. range	Package size	Freq. Temperature Characteristics	Power supply voltage	Power consumption (when stable)	RoHS	Pb free
		(MHz)	L×W×H(mm)	(×10-9)	(V DC)	(W max.)
9325D	Fixed Communication	100~100	26×26×13.67	±50	+12	1.3		(*1)
NH20M20LA	Fixed Communication	10~38.88	20.5×20.5×10.5	±200	+5	1.5		(*1)
NH25M22WA	Fixed Communication	10~40	25.4×22×15.7	±20	+3.3	1.3		(*1)
NH25M22WB	Fixed Communication	10~20	25.4×22×12.1	±20	+3.3	1.4		(*1)
NH25M22WC	Fixed Communication	10~20	25.4×22×7.8	±20	+5	2		(*1)
NH25M22WD	Fixed Communication	10~38.88	25.4×22×11.5	±300	+3.3	1		(*1)
NH25M22WE	Fixed Communication	10~38.88	25.4×22×10.5	±100	+3.3	1.2		(*1)
NH26M26LB	Fixed Communication	10~20	26×26×13.67	±10	+5	1.3		(*1)
NH26M26LA	Fixed Communication	10~20	26×26×11	±100	+3.3	1.3		(*1)
NH37M28LB	Fixed Communication	10~40	36×27×19	±10	+5	1.3		(*1)
NH37M28LA	Fixed Communication	10~40	36×27×19	±10	+5	1.3		(*1)
NH21M13LB	Fixed Communication	10~20	20.12×12.5×7.6	±100	+3.3	1		(*1)
NH21M13LA	Fixed Communication	10~38.88	21×13×9.2	±100	+12	1.1		(*1)
9740C-BDE01	Fixed Communication	10~10	40.0×40.0×24.5	±20	+12	4.5		(*1)
9740C-CDE01	Fixed Communication	5~5	40.0×40.0×24.5	±20	+12	4.5		(*1)

(*1)Lead in solder : The products are RoHS compliant as to lead in solder for servers, storage array systems, network infrastructure equipment for switching, signaling, transmission, network management for telecommunications also by the annex.

Specifications described in this site are subject to change without notice for improvement.
For more information such as "Reflow Soldering", "Precaution for use", and etc, please refer the Application Note.