[ General Guidance ] 
1. Terminology
2. Internal Structure of Crystal Units
3. Cutting Angeles and Vibration Mode
4. Cutting Angles and Frequencies
5. Equivalent Circuits and Characteristics of Crystal
[ Recommendable Oscillation Circuit ]
1. To ensure good electrical
2. To satisfy functional performance requirements
3. Reflow Soldering
4. Guarantees items
5. Matters to be addressed before product return
[ Model Names of Surface-mount (SMD) Products ]
[ Taping ]
[ General Guidance ]
1. Terminology
2. Precautions for Use
3. Measured Load Conditions
4. Circuit Diagrams
[ NZ1612S Series ]
1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications
[ NZ2016S Series ]
1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications
[ NZ2520S Series ]
1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications
[ NZ3225S Series ]
1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications
[ 2700 Series ]
1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Guaranteed Items
3. Package Indications
[ Model Names of Surface-mount (SMD) Products ]
[ Taping ]
[Precautions for use / Reflow Soldering]