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[ General Guidance ]

1. Terminology
2. Internal Structure of Crystal Units
3. Cutting Angeles and Vibration Mode
4. Cutting Angles and Frequencies
5. Equivalent Circuits and Characteristics of Crystal

[ Recommendable Oscillation Circuit ]

[ Precautions for Use ]

1. To ensure good electrical
2. To satisfy functional performance requirements
3. Reflow Soldering
4. Guarantees items
5. Matters to be addressed before product return

[ Model Names of Surface-mount (SMD) Products ]

[ Taping ]

[ Ordering Procedure ]

[ General Guidance ]

1. Terminology
2. Precautions for Use
3. Measured Load Conditions
4. Circuit Diagrams

[ NZ1612S Series ]

1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications

[ NZ2016S Series ]

1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications

[ NZ2520S Series ]

1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications

[ NZ3225S Series ]

1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Package Indications

[ 2700 Series ]

1. Example of Lead-free Soldering Conditions (Infrared Soldering)
2. Guaranteed Items
3. Package Indications

[ Model Names of Surface-mount (SMD) Products ]

[ Taping ]

[General Guidance]

[Precautions for use / Reflow Soldering]

[Model Names of Surface-mount (SMD) Products]

[Taping]

[General Guidance]

[Precautions for use]

[Model Names of Surface-mount (SMD) Products]

[Taping]

[Mechanical Options]

[Warranty Clause]

[Ordering Procedure]

[General Guidance]

[Precautions for use]

[Warranty Clause]

[Ordering Procedure]

[General Guidance]



 

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