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NX1612SD (for Mobile Communications)
Features
Crystal Unit with built-in Thermistor construction.
- Minimize circuit design space by combining crystal unit into one component.
(Presently, Crystal unit and temperature sensor is mounted in one board separately.) - Placing temperature sensor(Thermistor) close to Crystal blank in one airtight housing can detect more precise crystal blank temperature. Improvement on frequency temperature compensation compared to present Crystal unit.
- Single cavity housing which is ideal to module applications.
- External configuration size is 1.6x1.2mm typ., H0.65 mm max.
- A surface-mount crystal oscillator. (Reflow soldering is possible.)
- Lead-free. Meets the requirements for re-flow profiling using lead-free solder.