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切断方位和振动姿态
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Orientation angles from the crystal axis are selected according to use (oscillation frequencies and electrical characteristics) . Fig. 2 shows the main cutting angles. Table 1 shows the typical values of vibration modes, frequency ranges and capacitance ratios. For example, the most widely used AT-cut crystal wafer, is parallel to a plane inclined about 35°15' from the Z-axis. In the case of 28 MHz fundamental-wave thickness-shear vibration, the wafer thickness is approximately 0.06mm. |
Table 1 Basic Characteristics
Vibration Mode | Cut | Frequency Range (kHz) | Frequency Formula (kHz) | Capacitance Ratio (Typical) | |
---|---|---|---|---|---|
Thickness-shear![]() |
Overtone Order | AT Fundamental | 800 to 5000 2000 to 80000 |
1670/t 1670/t |
300 to 450 220 |
AT 3rd Overtone AT 5th Overtone AT 7th Overtone AT 9th Overtone |
20000 to 90000 40000 to 130000 100000 to 200000 150000 to 230000 |
1670×n/t | n²×250 n : Overtone Order |
||
BT Fundamental | 2000 to 35000 | 2560/t | 650 | ||
Flexural vibration (Tuning fork)![]() |
+2°X | 16 to 100 | 700×w/l² | 450 | |
Length-width-flexure![]() |
XY NT |
1 to 35 4 to 100 |
5700×t/l² 5000×w/l² |
600 900 |
|
Length-extensional![]() |
+5°X | 40 to 200 | 2730/l | 140 | |
Face-shear![]() |
CT DT SL |
250 to 1000 80 to 500 300 to 1100 |
3080/l 2070/l 460/l |
400 450 450 |