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Optical Component
High-Precision Processing Technology
We can process wavelength plates in the true zero order and high-precision lamination with parallelism of 1.0 μm or less for thicknesses of 4.0 mm or less, as well as automatic lamination for high precision and high quality in mass production specifications.
Thin Processing
Processing of true zero order wave plates requires thickness processing technology with higher precision compared to that of normal Quartz Wafer.
Our processing technology enables processing of true zero order wave plates up to 80 μm in thickness for 3 inch external size and 50 μm in thickness for 1 inch size.
Our processing technology enables processing of true zero order wave plates up to 80 μm in thickness for 3 inch external size and 50 μm in thickness for 1 inch size.
High-precision Bonding
High-precision bonding with parallelism of 0.5 μm or less is possible for large substrate bonding specifications with an external diameter of 45 mm, thickness of 4 mm, and bonding of six substrates. The acquisition of high-definition images with fewer aberrations is possible.
Automatic Bonding
We provide high-precision products by using our proprietary automatic bonding equipment developed and manufactured with our own technology.
Optical Component