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Materials for Semiconductors and Other Industries
Countermeasures Against "Invisible Gases"
in Manufacturing Environments Where Miniaturization Advances
Trace outgas that severely impacts products and processes
In manufacturing environments, minute outgas from materials exerts an unexpectedly significant impact on product quality and process reliability. In the increasingly miniaturized semiconductor manufacturing sector, this directly leads to challenges such as film deposition irregularities, reduced sensitivity, and worsened yield rates. Furthermore, in the automotive, medical device, and aerospace sectors, it poses risks of equipment malfunction and reduced reliability under vacuum or high-temperature conditions.
High-Precision Outgas Measurement Achieved with QCM Technology
QCM (Quartz Crystal Microbalance) technology is a sensor technology that measures mass changes in outgas emitted from materials at the nanogram level. It captures changes in real time and quantitatively, visualizing outgas profiles for each heating condition. This contributes to comparing material characteristics and optimizing processes.
Features
High-sensitivity detection of mass changes at the nanogram level
Acquisition of outgas profiles under various temperature conditions
Highly reproducible evaluation under vacuum conditions
Application in material development and process improvement
Examples of Outgassing Measurements by Application
Assessing outgassing risks during material selection
Measurement of Low-Molecular-Weight Cyclic Siloxanes
Pre-evaluates coating film unevenness and contamination risks during the selection stage of coating materials and silicon materials.
【 QTGA Properties of Low-Molecular Cyclic Siloxane by TQCM Mounted Compact Vacuum-Chamber System 】
Comparing to small cyclic siloxane D4 (4-body) to D8 (8-body), cyclic siloxane with a larger molecular weight desorbes at a higher temperature.
The siloxane type can be identified from the desorption temperature, and the content can be evaluated from the release rate.
Measurement of Phthalate Esters
Confirm safety and regulatory risks before adopting components containing resins or additives.
【 Cyclic Phthalate QTGA Characteristics by TQCM Mounted Small Vacuum Chamber System 】
Phthalate esters also have higher molecular weight and desorb at higher temperatures with higher boiling points.
The type of phthalic acid was identified from the desorption temperature, and the content could be evaluated from the release rate.
We Want to suppress the volatiles Generated During the Bonding and Fixing Process.
Measurement of Curing Temperature and Residual outgas of Conductive Adhesive
Evaluate the impact of gases generated during curing on electronic performance and reliability.
【 Confirmation of desorption Gas 】
Harden at 200℃ for 60 min. QTGA Characteristics
Hardening at 300℃ for 60 min. QTGA Characteristics
Residual outgas is removed by raising the hardening at 200℃ for 60 minutes to 300℃
Effective for verification of hardening conditions
We want to Ensure Material Compatibility in Vacuum Environments and Under
Sealed Conditions.
O-Ring Outgas Measurement
Evaluate outgassing risks of sealing materials in vacuum and space equipment in advance.
Fluorocarbon (FKM) exhibits lower outgas levels compared to silicone (VMQ) and nitrile (NBR),
making it a superior material choice in environments where outgas is a concern.
Furthermore, vacuum baking degassing treatment can reduce outgas emissions.
This is effective for verifying material selection for vacuum applications and the time required for material degassing
Resin Cable Outgas Measurement
Verifying cable material compatibility and effects under vacuum conditions
Fluoropolymer cables (FEP, ETFE) exhibit lower outgas levels compared to polyvinyl chloride (PVC) cables,
offering material advantages in environments affected by outgas.
PVC samples from Companies A and B, both conforming to the same standard, were compared; both exhibited a tendency for continuous outgas.
This confirms that even within the same PVC category, outgas components and emission levels can differ.
This method is effective for material selection for vacuum applications and for comparative verification of materials with identical compositions.
We wish to quantitatively assess the effectiveness of post-manufacturing cleaning and finishing processes.
Evaluation of Residual Components in Metal-Processed Parts Cleaning
Measuring the impact of residual oil outgas on product performance.
Confirmed that residual oil components present upon receipt of machined metal parts can be removed through proper cleaning.
Effective for acceptance inspection of machined metal parts and verification of cleaning conditions.
Identifying "Invisible Contamination Sources" After Implementation
Outgas Measurement of Residues from Implementation Substrates
Visualizing the release behavior of residual components under high-temperature and vacuum conditions.
Cleaning the board removes flux residue components, but it was confirmed that residues from certain cleaning agents can remain.
Effective for cleaning agent selection and cleaning condition verification.
What Component Analysis Alone Cannot Reveal, QCM Can
In product development and evaluation, it is essential to understand not only "what is being emitted" from outgas but also "how much impact it has."
- Q-mass excels at analyzing the composition (qualitative) of volatilized gases.
- QCM can visualize the quantitative impact--how much of the released components actually adsorb onto surfaces.
Combining these two methods enables multifaceted and practical evaluation of how materials' outgas behavior affects manufacturing processes.
| Item | QCM（Quartz Crystal Microbalance） | Q-mass（Quadrupole Mass Spectrometer） |
|---|---|---|
| Measurement Target | Adsorbed Mass (TML/CVCM Equivalent) | Mass and Concentration of Volatiles |
| Measurement Principle | Frequency Change of Quartz Crystal | Component Identification by m/z |
| Strengths | Quantification of Trace Components and Temporal Changes | Component Identification (Qualitative) |
| Usage Differences | How Much was Released | What was Released |
QCM captures how much of the released material actually adsorbs onto the sensor surface, enabling realistic evaluation of process risks and product impacts.
- Substances difficult to detect with Q-mass, such as polymers, highly polar organic compounds, and heavy components, can be detected as "mass" using QCM.
- Because it faithfully reflects the adhesion behavior onto the sensor surface, it is also effective for identifying minute contamination sources and for relative comparisons of materials.
- Especially during material development and screening stages, QCM's simple configuration and quantitative capability support rapid decision-making and specification determination.
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For consultations regarding material evaluation and measurement methods, or for any technical questions, please feel free to contact us.
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